| SMD2205-25000 - CHIP QUIK INC. - SOLDER SPHERES SN63/PB37 .025" D | |
| Packaging | Jar |
| Type | Solder Sphere |
| Composition | Sn63Pb37 (63/37) |
| Diameter | 0.025" (0.64mm) |
| Melting Point | 361°F (183°C) |
| Flux Type | - |
| Wire Gauge | - |
| Process | Leaded |
| Form | Jar |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |