| 573400D00010G - BOYD LACONIA, LLC - HEATSINK D-PAK3 TIN PLATED SMD | |
| Type | Top Mount |
| Package Cooled | TO-268 (D³Pak) |
| Attachment Method | SMD Pad |
| Shape | Rectangular, Fins |
| Length | 0.500" (12.70mm) |
| Width | 1.220" (30.99mm) |
| Diameter | - |
| Fin Height | 0.401" (10.20mm) |
| Power Dissipation @ Temperature Rise | 1.0W @ 20°C |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 600 LFM |
| Thermal Resistance @ Natural | 14.00°C/W |
| Material | Copper |
| Material Finish | Tin |