| 573300D00010G - BOYD LACONIA, LLC - HEATSINK D2PAK .4" HIGH SMD | |
| Type | Top Mount |
| Package Cooled | TO-263 (D²Pak) |
| Attachment Method | SMD Pad |
| Shape | Rectangular, Fins |
| Length | 0.500" (12.70mm) |
| Width | 1.030" (26.16mm) |
| Diameter | - |
| Fin Height | 0.400" (10.16mm) |
| Power Dissipation @ Temperature Rise | 1.3W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 10.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 18.00°C/W |
| Material | Aluminum |
| Material Finish | Tin |